First-Aid Kits for Circuit Boards ®
Haverhill, MA 01835 USA
A Circuit Technology Center Company
Tools and Materials
Qty Part No. Description
10 115-3302 Circuit Bond Epoxy
Pkg/5 235-2102-5 Foam Swab, Small
Pkg/5 235-2108-5 Foam Swab, Large
Pkg/5 355-3102-5 Micro Probes
2 Pkg/5 115-3315-5 Mixing Picks
2 Pkg/5 115-3312-5 Plastic Cup
115-1322 Circuit Bond Kit

This kit contains ten packages of clear, low viscosity, superior strength epoxy, precisely measured into two-compartment plastic packages, so there's no measuring.

Circuit Bond can be used to bond replacement conductors, repair burns, repair solder masks, and many other high-strength, high-temperature applications.

Two-compartment packaging eliminates mixing errors.
High strength/high temperature epoxy withstands demanding physical environments.
Clear, can be tinted with coloring agents.
Includes Foam Swabs for preparation and cleaning.
Includes Micro Probes, ideal for dispensing a tiny volume of adhesive.

Circuit Bond Specifications
Packaging2 gram pre-measured packages
Mix ratio4 parts resin to 1 part hardener
ColorClear, transparent
Pot life30 minutes
Cure cycle24 hours at room temperature or 4 hours @ 149°F (65°C)
Viscosity (after mixing)2000 cps
Operating temperature range-67°F to 275°F (-55°C to 135°C)
Hardness88 Shore D
Dielectric strength400 volts/mil
Shelf Life6 months minimum.
ShippingShipping by FedEx and UPS only.
First-Aid Kits for Circuit Boards ®
Haverhill, MA 01835 USA
A Circuit Technology Center Company
115-1322 Circuit Bond Kit

Visit the follow pages for details instructions.

Instructions and Procedures
Guide Page
2.4.1 Coating Replacement, Solder Mask
2.4.2 Coating Replacement, Conformal Coating, Encapsulant
2.4.3 Coating Replacement, Solder Mask, BGA Locations
2.6.3 Legend Marking, Stencil Method
2.7 Epoxy Mixing and Handling
3.1 Delamination/Blister Repair, Injection Method
3.3.1 Hole Repair, Epoxy Method
3.3.2 Hole Repair, Transplant Method
3.4.1 Key and Slot Repair, Epoxy Method
3.4.2 Key and Slot Repair, Transplant Method
3.5.1 Base Material Repair, Epoxy Method
3.5.2 Base Material Repair, Area Transplant Method
3.5.3 Base Material Repair, Edge Transplant Method
4.1.1 Lifted Conductor Repair, Epoxy Method
4.2.1 Conductor Repair, Foil Jumper, Epoxy Method
4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
4.2.4 Conductor Repair, Surface Wire Method
4.2.6 Conductor Repair, Inner Layer Method
4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method
4.3.2 Circuit Cut, Inner Layer Circuits
4.3.3 Deleting Inner Layer Connection at a Plated Hole, Drill Through Method
4.4.1 Lifted Land Repair, Epoxy Seal Method
4.4.2 Lifted Land Repair, Film Adhesive Method
4.5.1 Land Repair, Epoxy Method
4.5.2 Land Repair, Film Adhesive Method
4.6.1 Edge Contact Repair, Epoxy Method
4.7.1 Surface Mount Pad Repair, Epoxy Method