CircuitMedic
First-Aid Kits for Circuit Boards ®
www.circuitmedic.com
Haverhill, MA 01835 USA
A Circuit Technology Center Company
Tools and Materials
Qty Part No. Description
10 115-3302 Circuit Bond Epoxy
Pkg/5 235-2102-5 Foam Swab, Small
Pkg/5 235-2108-5 Foam Swab, Large
Pkg/5 355-3102-5 Micro Probes
2 Pkg/5 115-3315-5 Mixing Picks
2 Pkg/5 115-3312-5 Plastic Cup
115-1322 Circuit Bond Kit

This kit contains ten packages of clear, low viscosity, superior strength epoxy, precisely measured into two-compartment plastic packages, so there's no measuring.

Circuit Bond can be used to bond replacement conductors, repair burns, repair solder masks, and many other high-strength, high-temperature applications.

Two-compartment packaging eliminates mixing errors.
High strength/high temperature epoxy withstands demanding physical environments.
Clear, can be tinted with coloring agents.
Includes Foam Swabs for preparation and cleaning.
Includes Micro Probes, ideal for dispensing a tiny volume of adhesive.


Circuit Bond Specifications
Packaging2 gram pre-measured packages
Mix ratio4 parts resin to 1 part hardener
ColorClear, transparent
Pot life30 minutes
Cure cycle24 hours at room temperature or 4 hours @ 149°F (65°C)
Viscosity (after mixing)2000 cps
Operating temperature range-67°F to 275°F (-55°C to 135°C)
Hardness88 Shore D
Dielectric strength400 volts/mil
Shelf Life6 months minimum.
ShippingShipping by FedEx and UPS only.
CircuitMedic
First-Aid Kits for Circuit Boards ®
www.circuitmedic.com
Haverhill, MA 01835 USA
A Circuit Technology Center Company
115-1322 Circuit Bond Kit

Visit the follow pages for details instructions.

Instructions and Procedures
Guide Page
2.4.1 Coating Replacement, Solder Mask www.circuitrework.com/guides/2-4-1.html
2.4.2 Coating Replacement, Conformal Coating, Encapsulant www.circuitrework.com/guides/2-4-2.html
2.4.3 Coating Replacement, Solder Mask, BGA Locations www.circuitrework.com/guides/2-4-3.html
2.6.3 Legend Marking, Stencil Method www.circuitrework.com/guides/2-6-3.html
2.7 Epoxy Mixing and Handling www.circuitrework.com/guides/2-7.html
3.1 Delamination/Blister Repair, Injection Method www.circuitrework.com/guides/3-1.html
3.3.1 Hole Repair, Epoxy Method www.circuitrework.com/guides/3-3-1.html
3.3.2 Hole Repair, Transplant Method www.circuitrework.com/guides/3-3-2.html
3.4.1 Key and Slot Repair, Epoxy Method www.circuitrework.com/guides/3-4-1.html
3.4.2 Key and Slot Repair, Transplant Method www.circuitrework.com/guides/3-4-2.html
3.5.1 Base Material Repair, Epoxy Method www.circuitrework.com/guides/3-5-1.html
3.5.2 Base Material Repair, Area Transplant Method www.circuitrework.com/guides/3-5-2.html
3.5.3 Base Material Repair, Edge Transplant Method www.circuitrework.com/guides/3-5-3.html
4.1.1 Lifted Conductor Repair, Epoxy Method www.circuitrework.com/guides/4-1-1.html
4.2.1 Conductor Repair, Foil Jumper, Epoxy Method www.circuitrework.com/guides/4-2-1.html
4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method www.circuitrework.com/guides/4-2-2.html
4.2.4 Conductor Repair, Surface Wire Method www.circuitrework.com/guides/4-2-4.html
4.2.6 Conductor Repair, Inner Layer Method www.circuitrework.com/guides/4-2-6.html
4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method www.circuitrework.com/guides/4-2-7.html
4.3.2 Circuit Cut, Inner Layer Circuits www.circuitrework.com/guides/4-3-2.html
4.3.3 Deleting Inner Layer Connection at a Plated Hole, Drill Through Method www.circuitrework.com/guides/4-3-3.html
4.4.1 Lifted Land Repair, Epoxy Seal Method www.circuitrework.com/guides/4-4-1.html
4.4.2 Lifted Land Repair, Film Adhesive Method www.circuitrework.com/guides/4-4-2.html
4.5.1 Land Repair, Epoxy Method www.circuitrework.com/guides/4-5-1.html
4.5.2 Land Repair, Film Adhesive Method www.circuitrework.com/guides/4-5-2.html
4.6.1 Edge Contact Repair, Epoxy Method www.circuitrework.com/guides/4-6-1.html
4.7.1 Surface Mount Pad Repair, Epoxy Method www.circuitrework.com/guides/4-7-1.html