CircuitMedic
First-Aid Kits for Circuit Boards ®
www.circuitmedic.com
Haverhill, MA 01835 USA
A Circuit Technology Center Company
Tools and Materials
Qty Part No. Description
1 115-2706 Bonding Film
1 115-2801 Bonding Tip, Tapered
1 115-2802 Bonding Tip, .080" (2.03 mm) Diameter
1 115-2803 Bonding Tip, .120" (3.05 mm) Diameter
1 115-2805 Bonding Tip, .080" x .120" (2.03 x 3.05 mm)
1 115-3108 Practice Circuit Board
1 115-3206 Soldering Tips
4 115-3302 Circuit Bond Epoxy
Pkg/5 115-3312-5 Plastic Cup
Pkg/5 115-3315-5 Mixing Picks
1 201-7100 Precision Tool Set
Pkg/5 235-2102-5 Foam Swab, Small
Pkg/5 235-2106-5 Cleaning Brushes
Pkg/5 235-2108-5 Foam Swab, Large
Pkg/126 235-3025 High Temp Tape Discs
Pkg/60 235-3050 High Temp Tape Discs
1 310-2100 Wire Dots, Variety Pack
Pkg/5 355-3102-5 Micro Probes
1 525-2101-1 Circuit Frame, Assortment, Bright Tin Plated
1 525-2401-1 Circuit Frame, SMD Pads, Bright Tin Plated
1 525-2601-1 Circuit Frame, Lands/Pads, Bright Tin Plated
1 115-3210 Bonding Iron, 120 VAC
201-1400 Land/Pad Repair Kit, 120 VAC

This kit includes the tools and materials needed to reliably repair or replace damaged lands, surface mount, and BGA pads. The unique Circuit Frames have a dry film adhesive backing.

This kit is specifically designed to make the surface mount pad and land repair process as simple and reliable as possible.

Includes dry film, adhesive-backed replacement lands and pads that do not use messy liquid adhesives for bonding.
Includes a temperature controlled Bonding Iron and Bonding Tips.
Includes epoxy for solder mask or base board repair.
All the tools and materials are neatly arranged in a rugged carry case.
Tools and materials conform to IPC guidelines.
Every item is prime quality, time-tested, to meet high standards.


Visit the follow pages for details instructions.
Instructions and Procedures
Guide Page
4.1.2 Lifted Conductor Repair, Film Adhesive Method www.circuitrework.com/guides/4-1-2.html
4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method www.circuitrework.com/guides/4-2-2.html
4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method www.circuitrework.com/guides/4-2-7.html
4.4.2 Lifted Land Repair, Film Adhesive Method www.circuitrework.com/guides/4-4-2.html
4.5.1 Land Repair, Epoxy Method www.circuitrework.com/guides/4-5-1.html
4.5.2 Land Repair, Film Adhesive Method www.circuitrework.com/guides/4-5-2.html
4.6.1 Edge Contact Repair, Epoxy Method www.circuitrework.com/guides/4-6-1.html
4.7.1 Surface Mount Pad Repair, Epoxy Method www.circuitrework.com/guides/4-7-1.html
4.7.2 Surface Mount Pad Repair, Film Adhesive Method www.circuitrework.com/guides/4-7-2.html
4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method www.circuitrework.com/guides/4-7-3.html
4.7.4 Surface Mount, BGA Pad with Integral Via Repair www.circuitrework.com/guides/4-7-4.html
4.7.5 Surface Mount, BGA Pad, Integral Via, Circuit Extension Method www.circuitrework.com/guides/4-7-5.html