Qty |
Part No. |
Description |
1 |
115-2706 |
Bonding Film |
1 |
115-2801 |
Bonding Tip, Tapered |
1 |
115-2802 |
Bonding Tip, .080" (2.03 mm) Diameter |
1 |
115-2803 |
Bonding Tip, .120" (3.05 mm) Diameter |
1 |
115-2805 |
Bonding Tip, .080" x .120" (2.03 x 3.05 mm) |
1 |
115-3108 |
Practice Circuit Board |
1 |
115-3206 |
Soldering Tips |
4 |
115-3302 |
Circuit Bond Epoxy |
Pkg/5 |
115-3312-5 |
Plastic Cup |
Pkg/5 |
115-3315-5 |
Mixing Picks |
1 |
201-7100 |
Precision Tool Set |
Pkg/5 |
235-2102-5 |
Foam Swab, Small |
Pkg/5 |
235-2106-5 |
Cleaning Brushes |
Pkg/5 |
235-2108-5 |
Foam Swab, Large |
Pkg/126 |
235-3025 |
High Temp Tape Discs |
Pkg/60 |
235-3050 |
High Temp Tape Discs |
1 |
310-2100 |
Wire Dots, Variety Pack |
Pkg/5 |
355-3102-5 |
Micro Probes |
1 |
525-2101-1 |
Circuit Frame, Assortment, Bright Tin Plated |
1 |
525-2401-1 |
Circuit Frame, SMD Pads, Bright Tin Plated |
1 |
525-2601-1 |
Circuit Frame, Lands/Pads, Bright Tin Plated |
1 |
115-3210 |
Bonding Iron, 120 VAC |
201-1400 Land/Pad Repair Kit, 120 VAC
This kit includes the tools and materials needed to reliably repair or replace damaged lands, surface mount, and BGA pads. The unique Circuit Frames have a dry film adhesive backing.
This kit is specifically designed to make the surface mount pad and land repair process as simple and reliable as possible.
■ | Includes dry film, adhesive-backed replacement lands and pads that do not use messy liquid adhesives for bonding. |
■ | Includes a temperature controlled Bonding Iron and Bonding Tips. |
■ | Includes epoxy for solder mask or base board repair. |
■ | All the tools and materials are neatly arranged in a rugged carry case. |
■ | Tools and materials conform to IPC guidelines. |
■ | Every item is prime quality, time-tested, to meet high standards. |
Visit the follow pages for details instructions.
Instructions and Procedures |
Guide |
Page |
4.1.2 Lifted Conductor Repair, Film Adhesive Method |
www.circuitrework.com/guides/4-1-2.html |
4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method |
www.circuitrework.com/guides/4-2-2.html |
4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method |
www.circuitrework.com/guides/4-2-7.html |
4.4.2 Lifted Land Repair, Film Adhesive Method |
www.circuitrework.com/guides/4-4-2.html |
4.5.1 Land Repair, Epoxy Method |
www.circuitrework.com/guides/4-5-1.html |
4.5.2 Land Repair, Film Adhesive Method |
www.circuitrework.com/guides/4-5-2.html |
4.6.1 Edge Contact Repair, Epoxy Method |
www.circuitrework.com/guides/4-6-1.html |
4.7.1 Surface Mount Pad Repair, Epoxy Method |
www.circuitrework.com/guides/4-7-1.html |
4.7.2 Surface Mount Pad Repair, Film Adhesive Method |
www.circuitrework.com/guides/4-7-2.html |
4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method |
www.circuitrework.com/guides/4-7-3.html |
4.7.4 Surface Mount, BGA Pad with Integral Via Repair |
www.circuitrework.com/guides/4-7-4.html |
4.7.5 Surface Mount, BGA Pad, Integral Via, Circuit Extension Method |
www.circuitrework.com/guides/4-7-5.html |
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