| Qty |
Part No. |
Description |
| 1 |
115-3108 |
Practice Circuit Board |
| 4 |
115-3302 |
Circuit Bond Epoxy |
| Pkg/5 |
115-3312-5 |
Plastic Cup |
| Pkg/5 |
115-3315-5 |
Mixing Picks |
| 1 |
201-7100 |
Precision Tool Set |
| Pkg/5 |
235-2102-5 |
Foam Swab, Small |
| Pkg/5 |
235-2106-5 |
Cleaning Brushes |
| Pkg/5 |
235-2108-5 |
Foam Swab, Large |
| Pkg/120 |
235-3025 |
High Temp Tape Discs |
| Pkg/60 |
235-3050 |
High Temp Tape Discs |
| 1 |
310-2100 |
Wire Dots, Variety Pack |
| Pkg/5 |
355-3102-5 |
Micro Probes |
| 1 |
525-2101-1X |
Circuit Frame, Assortment, Bright Tin Plated, No Adhesive |
| 1 |
525-2102-1X |
Circuit Frame, Assortment, Bright Tin Plated, No Adhesive |
201-1600 Aerospace Repair Kit
Kit includes the tools and materials to replace damaged lands, surface mount, and BGA pads. The replacement pads and conductors are bonded to the circuit board surface using liquid epoxy supplied with the kit.
Kit is designed for Aerospace applications where out-gassing of epoxy may be an issue.
| ■ | Kit includes everything you need for pad and land repair or replacement. |
| ■ | Materials conforms to IPC guidelines. |
| ■ | Replacement lands and pads are bonded with liquid epoxy include with the kit. |
| ■ | Packaged in a handy case. |
Visit the follow pages for details instructions.
| Instructions and Procedures |
| Guide |
Page |
| 4.1.1 Lifted Conductor Repair, Epoxy Method |
www.circuitrework.com/guides/4-1-1.html |
| 4.4.1 Lifted Land Repair, Epoxy Seal Method |
www.circuitrework.com/guides/4-4-1.html |
| 4.5.1 Land Repair, Epoxy Method |
www.circuitrework.com/guides/4-5-1.html |
| 4.6.1 Edge Contact Repair, Epoxy Method |
www.circuitrework.com/guides/4-6-1.html |
| 4.7.1 Surface Mount Pad Repair, Epoxy Method |
www.circuitrework.com/guides/4-7-1.html |
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