| Instructions and Procedures |
| Guide |
Page |
| 2.4.1 Coating Replacement, Solder Mask |
www.circuitrework.com/guides/2-4-1.html |
| 2.4.2 Coating Replacement, Conformal Coating, Encapsulant |
www.circuitrework.com/guides/2-4-2.html |
| 2.4.3 Coating Replacement, Solder Mask, BGA Locations |
www.circuitrework.com/guides/2-4-3.html |
| 3.3.1 Hole Repair, Epoxy Method |
www.circuitrework.com/guides/3-3-1.html |
| 3.3.2 Hole Repair, Transplant Method |
www.circuitrework.com/guides/3-3-2.html |
| 3.4.1 Key and Slot Repair, Epoxy Method |
www.circuitrework.com/guides/3-4-1.html |
| 3.4.2 Key and Slot Repair, Transplant Method |
www.circuitrework.com/guides/3-4-2.html |
| 3.5.1 Base Material Repair, Epoxy Method |
www.circuitrework.com/guides/3-5-1.html |
| 3.5.2 Base Material Repair, Area Transplant Method |
www.circuitrework.com/guides/3-5-2.html |
| 3.5.3 Base Material Repair, Edge Transplant Method |
www.circuitrework.com/guides/3-5-3.html |
| 4.1.1 Lifted Conductor Repair, Epoxy Method |
www.circuitrework.com/guides/4-1-1.html |
| 4.1.2 Lifted Conductor Repair, Film Adhesive Method |
www.circuitrework.com/guides/4-1-2.html |
| 4.2.1 Conductor Repair, Foil Jumper, Epoxy Method |
www.circuitrework.com/guides/4-2-1.html |
| 4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method |
www.circuitrework.com/guides/4-2-2.html |
| 4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method |
www.circuitrework.com/guides/4-2-7.html |
| 4.4.2 Lifted Land Repair, Film Adhesive Method |
www.circuitrework.com/guides/4-4-2.html |
| 4.5.1 Land Repair, Epoxy Method |
www.circuitrework.com/guides/4-5-1.html |
| 4.5.2 Land Repair, Film Adhesive Method |
www.circuitrework.com/guides/4-5-2.html |
| 4.6.1 Edge Contact Repair, Epoxy Method |
www.circuitrework.com/guides/4-6-1.html |
| 4.6.2 Edge Contact Repair, Film Adhesive Method |
www.circuitrework.com/guides/4-6-2.html |
| 4.7.1 Surface Mount Pad Repair, Epoxy Method |
www.circuitrework.com/guides/4-7-1.html |
| 4.7.2 Surface Mount Pad Repair, Film Adhesive Method |
www.circuitrework.com/guides/4-7-2.html |
| 4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method |
www.circuitrework.com/guides/4-7-3.html |
| 4.7.4 Surface Mount, BGA Pad with Integral Via Repair |
www.circuitrework.com/guides/4-7-4.html |
| 4.7.5 Surface Mount, BGA Pad, Integral Via, Circuit Extension Method |
www.circuitrework.com/guides/4-7-5.html |
| 5.1 Plated Hole Repair, No Inner Layer Connection |
www.circuitrework.com/guides/5-1.html |
| 5.2 Plated Hole Repair, Double Wall Method |
www.circuitrework.com/guides/5-2.html |
| 5.3 Plated Hole Repair, Inner Layer Connection |
www.circuitrework.com/guides/5-3.html |
