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| Tools and Materials | ||
| Qty | Part No. | Description |
| Pkg/5 | 115-3315-5 | Mixing Picks |
| Pkg/3 | 115-9010 | Mask, High Temperature |
| Pkg/5 | 235-2108-5 | Foam Swab, Large |
| Pkg/5 | 235-4010 | Heat Shield Blanket, 5" x 7" |
| Pkg/5 | 235-4060 | Heat Shield Plates, 5" x 7" |
| 1 | 290-2075 | Tape, High Temperature |
| 1 | 335-3150 | Scissors, 8" |
| 1 | 335-3195 | Probe |
| 1 | 335-3197 | Scraper, Curved Tip |
201-3160 Heat Shield Kit
This kit includes all the tools and materials you need to protect heat-sensitive areas of an assembled circuit board from excessive heat exposure during rework operations.
Ideal for the protection of adjacent components at risk of collateral heat damage during hot gas surface mount and BGA rework.
| ■ | Aluminized heat shield insulates the circuit board surface and components from extreme heat. |
| ■ | Aluminum plates deflect excess heat. |
| ■ | Quick cure high temperature mask seals seams to block extraneous heat flow. |
| ■ | Includes high temperature tape, tools and materials. |
| ■ | All the tools and materials are packaged in a handy case. |
Visit the follow pages for details instructions.
| Instructions and Procedures | |
| Guide | Page |
| 7.4.3 Soldering Surface Mount J Lead Components, Hot Gas Method | www.circuitrework.com/guides/7-4-3.html |
| 7.5.3 Soldering Surface Mount Gull Wing Components, Hot Gas Method | www.circuitrework.com/guides/7-5-3.html |
| 8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas Method | www.circuitrework.com/guides/8-3-2.html |
| 8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas Method | www.circuitrework.com/guides/8-4-2.html |
| 9.2.1 BGA Component Rework Profile Development, Standard Method | www.circuitrework.com/guides/9-2-1.html |
| 9.2.2 BGA Component Rework Profile Development, Smart Track Method | www.circuitrework.com/guides/9-2-2.html |
| 9.3.1 BGA Component Rework | www.circuitrework.com/guides/9-3-1.html |