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525-2601-1X Circuit Frame, Lands/Pads, Bright Tin Plated
Circuit Frames are precision replacement conductor patterns used to repair damaged surface mount pads, lands and circuit traces on printed circuit boards. Manufactured from rolled annealed copper and plated with bright-tin, tin-lead, or nickel-gold, these replacement patterns closely match the geometry and conductivity of the original PCB circuitry.
Each Circuit Frame contains multiple precision-etched pads, lands, or conductor shapes arranged on a small copper frame. The technician simply selects the appropriate pattern, trims it from the frame and bonds it to the circuit board surface using controlled heat and pressure. Versions with dry-film adhesive backing cure in approximately 30 seconds using a bonding iron or bonding system, creating a bond strength comparable to the original circuit without the mess of liquid epoxy.
Circuit Frames are widely used to restore damaged SMT pads, BGA pads, edge contacts, and conductor patterns during PCB repair and rework procedures. The process follows IPC-recommended repair methods and meets the highest conformance levels for circuit board repair.
Available in hundreds of shapes and sizes, Circuit Frames are used by commercial, medical, and military electronics manufacturers worldwide to restore circuit functionality quickly and reliably. If you have a request for a custom Circuit Frame, call or use our Contact Us form.
All Circuit Frames
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Custom Circuit Frame Pricing
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| Circuit Frame Type |
Min Qty |
Price |
| Tin Plated |
50 |
$63.00 Each |
| Tin/Lead Plated |
50 |
$63.00 Each |
| Nickel/Gold Plated |
25 |
$219.00 Each |
| Orders also require a one-time $1295.00 tooling charge. |
| Lead Time: 10 weeks after receipt of order. |
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PACE ThermoBond Cross Reference
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| Description |
PACE ThermoBond CIK-KIT |
CircuitMedic |
| Straight Conductors |
1200-0074-P1, 1200-0158-01
1200-0164-01, 1200-0165-01 |
525-2301-1, 525-2301-2 |
| Surface Mount Pads |
1200-0147-01, 1200-0148-01, 1200-0149-01
1200-0150-01, 1200-0151-01, 1200-0152-01
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525-2401-1, 525-2401-2
525-2402-1, 525-2402-2
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| Lands and Plated Holes |
1200-0070-P1, 1200-0072-P1
1200-0159-01, 1200-0161-01
1200-1063-01 |
525-2601-1, 525-2602-1 |
| Edge Contacts |
1200-0071-P1, 1200-0161-01
1200-0162-01 |
525-2601-1, 525-2602-1 |
| There are no direct cross-references; please compare specifications before ordering. |
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| Shapes and Pattens |
| - |
Qty |
Shapes, Patterns Included |
| A | 6 | PTH Lands 0.050" OD x 0.030" ID (1.27 mm OD x 0.76 mm ID) |
| B | 6 | PTH Lands 0.060" OD x 0.040" ID (1.52 mm OD x 1.00 mm ID) |
| C | 6 | PTH Lands 0.070" OD x 0.040" ID (1.78 mm OD x 1.00 mm ID) |
| D | 6 | PTH Lands 0.080" OD x 0.050" ID (1.27 mm OD x 1.27 mm ID) |
| E | 6 | PTH Lands 0.090" OD x 0.055" ID (1.52 mm OD x 1.40 mm ID) |
| F | 6 | PTH Lands 0.100" OD x 0.060" ID (1.78 mm OD x 1.52 mm ID) |
| Base Material Specifications |
| Overall Frame Size |
2.25" x 1.50" (57 x 38 mm) |
| Base Material |
Rolled Annealed Copper Foil, UNS C11000 (Alloy C110), ASTM B152, IPC-4562A, 0.0014 in (0.036 mm) thick. |
| Plating |
Bright Tin: .0001" (.0025 mm)
(Lead Free), RoHS Compliant: .0001" (.0025 mm) 63/37 Tin/Lead, Non RoHS Compliant Nickel/Gold: .000050" (.00127 mm) Gold over .000100" (.00254 mm) Nickel, RoHS Compliant |
| Surface Treatments |
Top side plated. Bottom side treated to promote adhesion. |
| Shelf Life |
Shelf life of base material without adhesive application is unlimited. |
| RoHS and REACH |
CircuitMedic Circuit Frames contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH. |
| Adhesive Backing Specifications |
| Adhesive Backing |
Optional adhesive backing film is applied using a quick-bond process that retains B-staged adhesive properties. |
| Adhesive Material |
B-staged modified acrylic film adhesive .002" (.051 mm) thick. |
| Certification |
Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films. |
| Solder Resistance |
Passes IPC-TM-650, 2.4.13 Solder Float Resistance 10 seconds at 288°C (550°F). |
| Bonding Temperature |
475°F ± 25°F (246°C ± 14°C) |
| Bonding Pressure |
200 - 400 psi (14-28 kg/cm2) |
| Bonding Time |
30 seconds |
| Peel Strength |
Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material. |
| Outgassing |
The Bonding Film used on Circuit Frames consistently meet the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06% |
| Shelf Life |
One year minimum. Each Circuit Frame package is stamped with the expiration date. Adhesive material is sensitive to light and heat. Store in a dark or refrigerated environment to preserve the shelf life. |
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| Classifications |
| Harmonized Code |
7410.21.6000 |
| Export Administration Regulations (EAR) |
EAR99 |
| Export Control Classification Number (ECCN) |
Not Applicable |
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