Bonding Tips

Bonding Tips fit into the handheld Bonding Iron. The bottom surface of each Bonding Tip is used to apply heat and pressure to bond adhesive-backed replacement lands, pads, and edge contacts to a circuit board surface. All Bonding Tips are machined from high-grade aluminum. Bonding Tips do not have a plated finish and may be machined as needed. Pressure Pressure is the recommended force in pounds to apply to the top surface of the replacement pad, land, or conductor based on the Bonding Tip surface area. The recommended Bonding Pressure for Circuit Frames is 200 - 400 psi. Available Sizes Part No. Pressure 115-2801 Bonding Tip, Tapered N/A 115-2802 Bonding Tip, .080" (2.03 mm) Diameter 1.00 lbs (0.45 kg) 115-2803 Bonding Tip, .120" (3.05 mm) Diameter 2.26 lbs (1.02 kg) 115-2804 Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm) 0.48 lbs (0.218 kg) 115-2805 Bonding Tip, .080" x .120" (2.03 x 3.05 mm) 1.92 lbs (0.87 kg)

Ordering Part No. Description Price Qty / Order 115-2801 Bonding Tip, Tapered $45.00 Each 115-2802 Bonding Tip, .080" (2.03 mm) Diameter $45.00 Each 115-2803 Bonding Tip, .120" (3.05 mm) Diameter $45.00 Each 115-2804 Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm) $45.00 Each 115-2805 Bonding Tip, .080" x .120" (2.03 x 3.05 mm) $45.00 Each Order direct or from a distributor. Freight, duties, and value added taxes may increase prices for products outside USA.