Bonding Tips
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Bonding Tips fit into the handheld Bonding Iron. The bottom surface of each Bonding Tip is used to apply heat and pressure to bond adhesive-backed replacement lands, pads, and edge contacts to a circuit board surface. All Bonding Tips are machined from high-grade aluminum. Bonding Tips do not have a plated finish and may be machined as needed.
Pressure
Pressure is the recommended force in pounds to apply to the top surface of the replacement pad, land, or conductor based on the Bonding Tip surface area. The recommended Bonding Pressure for Circuit Frames is 200 - 400 psi.
Part No. |
Pressure |
115-2801 Bonding Tip, Tapered |
N/A |
115-2802 Bonding Tip, .080" (2.03 mm) Diameter |
1.00 lbs (0.45 kg) |
115-2803 Bonding Tip, .120" (3.05 mm) Diameter |
2.26 lbs (1.02 kg) |
115-2804 Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm) |
0.48 lbs (0.218 kg) |
115-2805 Bonding Tip, .080" x .120" (2.03 x 3.05 mm) |
1.92 lbs (0.87 kg) |
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Part No. |
Description |
Price |
Qty / Order |
115-2801 |
Bonding Tip, Tapered |
$45.00 Each |
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115-2802 |
Bonding Tip, .080" (2.03 mm) Diameter |
$45.00 Each |
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115-2803 |
Bonding Tip, .120" (3.05 mm) Diameter |
$45.00 Each |
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115-2804 |
Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm) |
$45.00 Each |
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115-2805 |
Bonding Tip, .080" x .120" (2.03 x 3.05 mm) |
$45.00 Each |
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Order direct or from a distributor. Freight, duties, and value added taxes may increase prices for products outside USA.
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