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115-4100 Bonding System

You'll appreciate the accuracy of this calibrated Bonding Press, especially when repairing surface mount and BGA pads.

The press not only gives the operator better control over the bonding process, but also ensures optimal adhesion and repeatability.

The system has a built-in calibration scale to maintain a regulated bonding force and the digital temperature controller in the power unit base maintains a uniform temperature throughout the 30-second bonding cycle.

Systems include one each of the following Bonding Tips.
  • You'll appreciate the accuracy of this calibrated Bonding Sress, especially when repairing surface mount and BGA pads.

  • The system comes with an adjustable Temperature Controller to accurately set the tip temperature.

  • The system has a built-in calibration scale to maintain a regulated bonding force throughout the 30-second bonding cycle.

  • The Bonding System comes with three Circuit Frames. Circuit Frames have a dry film adhesive backing so messy liquid adhesives are not needed for bonding.

  • Use the Bonding System and Circuit Frames to replace lifted and damaged surface mount and BGA pads. The repaired pad will meet the highest IPC guidelines.

  • Use the Bonding System and Circuit Frames to replace lifted and damaged lands. The repaired land will meet the highest IPC guidelines.

Specifications
Frame ConstructionHeavy gauge aluminum and steel
Throat Depth260 mm
Throat Height100 mm
Vertical Travel100 mm
Weight10 lb. (4.5 kg.)
Power Input120 or 230 VAC
Temperature Controller Range200 °C to 480 °C
Resolution1 °C
Power Consumption45 Watts
Output Voltage24 VAC
Heat Up Time5 minutes
Features
Precision design for bonding of extremely small pads.
Heavy duty construction provides a stable platform.
Calibration gauge maintains regulated bonding force.
Temperature controller maintains uniform temperature.
Includes 4 various Bonding Tips.
Ordering
Part No. Description Price Order
115-4100 Bonding System, 120 VAC $1995.00 Each
115-4102 Bonding System, 230 VAC $1995.00 Each
Order direct or from a distributor. Harmonize Code: 8514.10.0000
Freight, duties, and value added taxes may increase prices for products outside USA.
Bonding System Includes
Qty Part No. / Item Price Order
1
image
115-2204 Bonding Tip, .080" (2.03 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each
1
image
115-2206 Bonding Tip, .120" (3.05 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each
1
image
115-2306 Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm)
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each
1
image
115-2316 Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm)
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each
1
Circuit Frame
CBLANKAS Circuit Frame
Blank - Bright Tin
$44.00 Each
1
Circuit Frame
CFV002AS Circuit Frame
Variety - Bright Tin
$44.00 Each
1
Circuit Frame
CFV003AS Circuit Frame
Variety - Bright Tin
$44.00 Each
Optional Items
Part No. / Item Price Order
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115-3125 Calibration Thermocouple
Thermocouple used to calibrate Temperature Controller.
$179.00
Instructions
INS1076 Bonding System
INS1059 Bonding Tips
INS1063 Circuit Bond Epoxy
INS1060 Circuit Frames
Reference Guide Procedures
Number / Title
1.0 Foreword
2.0 Basic Procedures
2.2 Cleaning
2.7 Epoxy Mixing and Handling
3.0 Base Board Procedures
4.1.2 Lifted Conductor Repair, Film Adhesive
4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
4.5.2 Land Repair, Film Adhesive
4.6.2 Edge Contact Repair, Film Adhesive
4.7.2 Surface Mount Pad Repair, Film Adhesive
4.7.3 BGA Pad Repair, Film Adhesive

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