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115-4300 Bonding System

You'll appreciate the accuracy of this precision machine, especially when replacing and repairing surface mount and BGA pads when using Circuit Frames with dry film epoxy adhesive.

The Bonding System not only gives the operator better control over the bonding process but also ensures optimal epoxy adhesion and process repeatability.

The system has a built-in calibration gauge to maintain a regulated bonding force plus adjustable temperature control for the optimal temperature required for curing the bonding film used to repair damaged surface mount pads, lands, edge contacts, and other circuit board patterns.

115-4300 Bonding System
Available with optional stereo zoom microscope.
  • You'll appreciate the accuracy of this calibrated Bonding Press, especially when repairing surface mount and BGA pads.

  • The system has a built-in calibration scale to maintain a regulated bonding force throughout the 30-second bonding cycle.

  • The Bonding System is also available with a Stereo Zoom Microscope.

  • Use the Bonding System and Circuit Frames to replace lifted and damaged surface mount and BGA pads. The repaired pad will meet the highest IPC guidelines.

  • Use the Bonding System and Circuit Frames to replace lifted and damaged lands. The repaired land will meet the highest IPC guidelines.

Specifications
Frame ConstructionHeavy gauge aluminum and steel
Throat Depth400 mm+
Throat Height150 mm
Weight20 lb. (4.5 kg.)
Power Input120 VAC or 230 VAC
Temperature Range200 °C to 450 °C
Power Consumption45 Watts
Output Voltage24 VAC
Heat Up Time5 minutes
Features
Precision design for bonding of extremely small pads.
Heavy duty stainless steel arms and post construction.
Wide, heavy base plate for stability.
Calibration gauge maintains regulated bonding force.
Temperature controller maintains uniform temperature.
Includes 4 Bonding Tips.
Ordering
Part No. Description Price Qty / Order
115-4300 Bonding System, 120 VAC $1995.00 Each
115-4302 Bonding System, 230 VAC $1995.00 Each
115-4308 Stereo Zoom Microscope $1995.00 Each
Order direct or from a distributor. Harmonize Code: 8514.10.0000
Freight, duties, and value added taxes may increase prices for products outside USA.
Bonding System Includes
Qty Part No. / Item Price Qty / Order
1
image
115-2204 Bonding Tip, .080" (2.03 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each
1
image
115-2206 Bonding Tip, .120" (3.05 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each
1
image
115-2306 Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm)
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each
1
image
115-2316 Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm)
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each
Optional Items
Part No. / Item Price Order
image
115-3125 Calibration Thermocouple
Thermocouple used to calibrate Temperature Controller.
$179.00
Instructions
INS1104 Bonding System
INS1059 Bonding Tips
INS1063 Circuit Bond Epoxy
INS1060 Circuit Frames
Reference Guide Procedures
Number / Title
1.0 Foreword
2.0 Basic Procedures
2.2 Cleaning
2.7 Epoxy Mixing and Handling
3.0 Base Board Procedures
4.1.2 Lifted Conductor Repair, Film Adhesive
4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
4.5.2 Land Repair, Film Adhesive
4.6.2 Edge Contact Repair, Film Adhesive
4.7.2 Surface Mount Pad Repair, Film Adhesive
4.7.3 BGA Pad Repair, Film Adhesive

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