The Aerospace Repair Kit provides the tools and materials needed to reliably replace damaged lands, surface-mount pads and BGA pads on printed circuit boards. This specialized kit is designed for aerospace and high-reliability applications where epoxy out-gassing must be carefully controlled during repair procedures.

Replacement pads and lands are supplied on Circuit Frames made from rolled copper electroplated with tin, allowing technicians to select the correct conductor pattern, trim it from the frame and bond it to the circuit board using the included high-strength epoxy. This method restores the original pad geometry and solderability while maintaining reliable mechanical and electrical performance.

The kit includes precision tools, Circuit Bond epoxy, mixing supplies, cleaning materials and a practice circuit board for developing repair techniques. High-temperature tape discs, foam swabs, micro-probes and Wire Dots support accurate application and handling during repair operations.

All tools and materials are organized in a rugged carrying case, creating a portable repair solution suitable for laboratory, production and field service environments.