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B4-668-2727-100 Flextac Rework Stencil

stencil
CircuitMedic Stencils are self-sticking solder paste stencils. These laser cut, polymer stencils use a full-release, residue-free adhesive similar to sticky notes.

The self-sticking adhesive on the bottom of the stencil seals around each BGA pad to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable CircuitMedic Stencils are easy to use and will not leave any residue on the board surface.

If you currently use metal stencils you need to fixture them or tape them in position to hold them in place. Metal stencils can warp, and if the circuit board has undulations in the board surface, the metal stencil will not sit flat.

Since there is no gasket-like seal, solder paste can easily bleed under metal stencils when paste is applied with a squeegee. Also solder paste can spill out over the sides of flat stencils contaminating the circuit board surface.

US Patent number: 6,253,675

CircuitMedic BGA Rework Stencil Index

Ordering
Part No. B4-668-2727-100
Thickness .004" (0.102 mm)
Aperture .020" (0.508 mm)
Balls 668
Pitch 1.000 mm
Component 27 mm x 27 mm
Price $129.00 Pkg/10 Total $645.00
Mimimum 5 Packages
Qty / Order
Order direct or from a distributor. Harmonize Code: 3920.69.0000.
Freight, duties, and value added taxes may increase prices for products outside USA.
Optional Items
Part No. Price Order
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115-3504 Squeegee Blade, 12mm Wide
Stainless steel squeegee blade used to spread solder paste.
$18.95 Pkg/3
image
115-3506 Squeegee Blade, 27mm Wide
Stainless steel squeegee blade used to spread solder paste.
$18.95 Pkg/3
image
115-3508 Squeegee Blade, 35mm Wide
Stainless steel squeegee blade used to spread solder paste.
$18.95 Pkg/3
image
115-3502 Squeegee Handle
Handle holds squeegee blades used to spread solder paste.
$6.50 Each

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