CS004085AT Circuit Frame, Surface Mount Pads .004" x .085" (.102 mm x 2.159 mm)
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Slightly Larger Than Actual Size.
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Circuit Frames are used to replace damaged surface mount pads, lands, and conductors.
Circuit Frames have a dry-film adhesive backing that is cured in 30 seconds using heat from a bonding Iron.
The replaced pad, land, or conductor has a bond strength equal to the original, and no messy liquid epoxies are used for bonding.
This reliable IPC-recommended procedure meets the highest conformance level for this type of circuit board rework or repair.
For over 40 years, Circuit Frames have been used by thousands of commercial, medical, and military manufacturers around the globe.
Discontinued - No longer available.
There is no direct cross reference to another Circuit Frame.
If you require this specific pattern, submit a request using the form lower on this page.
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| Overall Frame Size |
2.25" x 1.50" (57 x 38 mm) |
| Base Material |
Rolled annealed copper foil .0014" (.036 mm) thick. |
| Surface Treatments |
Top side plated. Bottom side treated to promote adhesion. |
| Shelf Life |
Shelf life of base material without adhesive application is unlimited. |
| RoHS and REACH |
CircuitMedic Circuit Frames contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH. |
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| Adhesive Backing |
Optional adhesive backing film is applied using a quick-bond process that retains B-staged adhesive properties. |
| Adhesive Material |
B-staged modified acrylic film adhesive .002" (.051 mm) thick. |
| Certification |
Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films. |
| Solder Resistance |
Passes IPC Spec 10 sec at 288°C (550°F). |
| Bonding Temperature |
475°F ± 25°F (246°C ± 14°C) |
| Bonding Pressure |
200 - 400 psi (14-28 kg/cm2) |
| Bonding Time |
30 seconds |
| Peel Strength |
Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material. |
| Outgassing |
The Bonding Film used on Circuit Frames consistently meet the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM.
Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06% |
| Shelf Life |
One year minimum. Each Circuit Frame package is stamped with the expiration date. Adhesive material is sensitive to light and heat.
Store in a dark or refrigerated environment to preserve the shelf life. |
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| Bright Tin |
.0001" (.0025 mm) Bright Tin (Lead Free), RoHS Compliantt |
| Tin/Lead |
.0001" (.0025 mm) 63/37 Tin/Lead, Non RoHS Compliant |
| Nickel/Gold |
.000050" (.00127 mm) Gold over .000100" (.00254 mm) Nickel, RoHS Compliant |
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| Part No. |
Description |
Plating |
Price |
Qty / Order |
| CS004085AT |
Circuit Frame, Surface Mount Pads .004" x .085" (.102 mm x 2.159 mm) |
Tin/Lead |
$59.00 Each |
Discontinued
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Order direct or from a distributor. Harmonize Code: 7410.21.6000
Freight, duties, and value added taxes may increase prices for products outside USA.
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| Part No. |
Description |
Price |
Qty/Order |
| 115-3210 |
Bonding Iron, 120 VAC
Delivers the optimal heat for curing adhesive bonding film.
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$69.00 Each |
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| 115-3220 |
Bonding Iron, 220 VAC
Delivers the optimal heat for curing adhesive bonding film.
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$74.00 Each |
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| 115-2801 |
Bonding Tip, Tapered
Tip used to bond replacement conductors to circuit boards for repair.
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$45.00 Each |
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| 115-2802 |
Bonding Tip, .080" (2.03 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
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$45.00 Each |
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| 115-2803 |
Bonding Tip, .120" (3.05 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
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$45.00 Each |
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| 115-2804 |
Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm)
Tip used to bond replacement conductors to circuit boards for repair.
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$45.00 Each |
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| 115-2805 |
Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm)
Tip used to bond replacement conductors to circuit boards for repair.
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$45.00 Each |
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