CS004085AT Circuit Frame, Surface Mount Pads .004" x .085" (.102 mm x 2.159 mm)
Discontinued - No longer available.
There is no direct cross reference to another Circuit Frame.
| Ordering | |||
| Part No. | Description | Price | Qty / Order |
| CS004085AT | Circuit Frame, Surface Mount Pads .004" x .085" (.102 mm x 2.159 mm), Tin/Lead Plated | Discontinued | Discontinued |
Base Material Specifications ▼
| Overall Frame Size | 2.25" x 1.50" (57 x 38 mm) |
| Base Material | Rolled annealed copper foil .0014" (.036 mm) thick. |
| Plating | .0001" (.0025 mm) 63/37 Tin/Lead, Non RoHS Compliant |
| Surface Treatments | Top side plated. Bottom side treated to promote adhesion. |
| Shelf Life | Shelf life of base material without adhesive application is unlimited. |
| RoHS and REACH | CircuitMedic Circuit Frames contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH. |
Adhesive Backing Specifications ▼
| Adhesive Backing | Optional adhesive backing film is applied using a quick-bond process that retains B-staged adhesive properties. |
| Adhesive Material | B-staged modified acrylic film adhesive .002" (.051 mm) thick. |
| Certification | Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films. |
| Solder Resistance | Passes IPC-TM-650, 2.4.13 Solder Float Resistance 10 seconds at 288°C (550°F). |
| Bonding Temperature | 475°F ± 25°F (246°C ± 14°C) |
| Bonding Pressure | 200 - 400 psi (14-28 kg/cm2) |
| Bonding Time | 30 seconds |
| Peel Strength | Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material. |
| Outgassing | The Bonding Film used on Circuit Frames consistently meet the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06% |
| Shelf Life | One year minimum. Each Circuit Frame package is stamped with the expiration date. Adhesive material is sensitive to light and heat. Store in a dark or refrigerated environment to preserve the shelf life. |
Classifications ▼
| Harmonize Code | 7410.21.6000 |
| Export Administration Regulations (EAR) | EAR99 |
| Export Control Classification Number (ECCN) | Not Applicable |
Optional Items ▼
| Part No. | Description | Price | Qty/Order |
| 115-2706 |
Dry film adhesive used to bond lifted lands, pads and conductors. |
$17.00 Each | |
| 115-3210 |
Delivers the optimal heat for curing adhesive bonding film. |
$76.00 Each | |
| 115-3220 |
Delivers the optimal heat for curing adhesive bonding film. |
$76.00 Each | |
| 115-2801 |
Tip used to bond replacement conductors to circuit boards for repair. |
$48.00 Each | |
| 115-2802 |
Tip used to bond replacement conductors to circuit boards for repair. |
$48.00 Each | |
| 115-2803 |
Tip used to bond replacement conductors to circuit boards for repair. |
$48.00 Each | |
| 115-2804 |
Tip used to bond replacement conductors to circuit boards for repair. |
$48.00 Each | |
| 115-2805 |
Tip used to bond replacement conductors to circuit boards for repair. |
$48.00 Each | |
| 110-6380 |
Sturdy holder supports PCBs for rework, drilling, pad repair, and positioning. |
$595.00 Each | |
| 201-5231 |
System to thermally bond replacement conductors, BGA pads, and SMT pads. |
$6995.00 Each |
Contact Form ▼
