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115-3302 Circuit Bond Epoxy

115-3302 Circuit Bond Epoxy
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Clear, low viscosity, superior strength epoxy, precisely measured out into two-compartment plastic packages so it's easy to use and there's no measuring.

Specifications
Packaging2 gram pre-measured packages
Mix ratio4 parts resin to 1 part hardener
Mix Ratio by Weight (R/H)100/25
ColorClear, transparent
Pot life30 minutes
Cure cycle24 hours at room temperature (25 °C) or 4 hours @ 65°C
Thixotropic Index1
Specific Gravity1.20
Percent Solids100%
Viscosity (after mixing)2000 cps
Operating temperature range-55°C to 135°C
Hardness88 Shore D
Lap Shear, Alum to Alum1100 psi
Glass Transition Temperature, Ultimate92°C
Coefficient of Expansion, cm/cm/°C6 E-05
Dielectric strength400 volts/mil
Dielectric Constant, 1KHz@25°C4
Shelf Life6 months minimum
Application Instructions
1. Circuit Bond has a working pot life of 30 minutes. It should not be mixed until ready to use.
2. To use Circuit Bond, remove the plastic clip separating the resin and hardener. Squeeze back and forth from one half of the package to the other to mix the contents.
3. Cut a corner off the package and squeeze all the contents into a Plastic Cup. Stir the contents to ensure it is thoroughly mixed.
4. NOTE: Circuit Bond may contain bubbles from the mixing process. If needed use a vacuum system to remove bubbles.
5. If desired Color Agent can be mixed in with Circuit Bond to match surface colors.
6. Apply using a Foam Swab, Micro Probe or Mixing Stick as required.
7. Cure Circuit Bond for 24 hours at room temperature or 4 hours at 65°C (150°F).
ship Ship FedEx and UPS Only.
Ordering
Part No. Description Price Order
115-3302 115-3302 Circuit Bond Epoxy $13.95 Each
Order direct or from a distributor. Harmonize Code: 3506.91.0000
Freight, duties, and value added taxes may increase prices for products outside USA.
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