115-3302 Circuit Bond Epoxy
$19.00 Each
Ship FedEx and UPS Only.
Specifications ▼
| Packaging | 2 gram pre-measured packages |
| Mix ratio | 4 parts resin to 1 part hardener |
| Mix Ratio by Weight (R/H) | 100/25 |
| Color | Clear, transparent |
| Pot life | 30 minutes |
| Cure cycle | 24 hours at room temp (25 °C) or 4 hours @ 65°C |
| Thixotropic Index | 1 |
| Specific Gravity | 1.20 |
| Percent Solids | 100% |
| Viscosity (after mixing) | 2000 cps |
| Operating temperature range | -55°C to 135°C |
| Hardness | 88 Shore D |
| Lap Shear, Alum to Alum | 1100 psi |
| Glass Transition Temperature, Ultimate | 92°C |
| Coefficient of Expansion, cm/cm/°C | 6 E-05 |
| Dielectric strength | 400 volts/mil |
| Dielectric Constant, 1KHz@25°C | 4 |
| Shelf Life | 6 months minimum |
How To Use Istructions▼
- Circuit Bond has a working pot life of 30 minutes. It should not be mixed until ready to use.
- To use Circuit Bond, remove the plastic clip separating the resin and hardener. Squeeze back and forth from one half of the package to the other to mix the contents.
- Cut a corner off the package and squeeze all the contents into a plastic cup. Stir the contents to ensure it is thoroughly mixed.
- NOTE: Circuit Bond may contain bubbles from the mixing process. If needed, use a vacuum system to remove bubbles.
- If desired, a color agent can be mixed with Circuit Bond to match surface colors.
- Apply using a foam swab, micro-probe, or mixing stick as required.
- Cure Circuit Bond for 24 hours at room temperature or 4 hours at 65°C (150°F).
| Ordering | ||
| 115-3302 | 115-3302 Circuit Bond Epoxy | |
Classifications ▼
| Harmonize Code | 3506.91.0000 |
| Export Administration Regulations (EAR) | EAR99 |
| Export Control Classification Number (ECCN) | Not Applicable |
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