CircuitMedic BGA Reball Fixtures are precision-engineered for specific BGA components.
Each fixture consists of an upper and lower aluminum frame, with precision laser-cut stainless steel templates secured to both halves.
The design features no moving parts, ensuring consistent precision and accuracy.
How it Works
Pad Preparation: Excess solder is removed from the BGA component pads using solder braid or another suitable method, creating a flat, even surface on each pad.
Flux Application: Solder flux is applied to the prepared pads of the BGA component.
Component Placement: The BGA component is positioned into the lower half of the fixture.
Solder Ball Loading: The upper half of the fixture is mated with the lower half. Solder balls are then dispensed to fill the stencil apertures.
Excess Solder Balls: Excess solder balls are poured out through a chute and can be reused.
Inspection: The upper half of the fixture is removed carefully. The component is visually inspected to confirm a solder ball is seated on each pad.
Reflow: The lower half of the fixture, along with the BGA component, is placed into a convective reflow oven, batch oven, or IR system to reflow the solder balls.
Completion: After the reflow cycle, the component is removed from the fixture and is ready for reuse.
If we don't have a fixture the size you need, see the form at the bottom of the page.
Remove the solder and solder balls from the BGA component pads using a robotic system, solder braid, desolder tool, or other approved method. The BGA pads should be smooth and flat.
Clean the BGA components using an approved method. Inspect the BGA components to ensure there has been no damage to the component body or pads.
Apply tacky flux or flux paste to the pads of the BGA component by brushing, spray, or other approved method.
Place the BGA component into the lower half of the BGA Reball Fixture using tweezers or other approved tool.
The cutout in the stencil retaining the component (-B-) is slightly larger then the specified component body size.
The component body size may be larger than listed in the specifications. Components should be measured to confirm dimensions. See Figure 1 and 2.
Mate the upper half of the BGA Reball Fixture to the lower half using the built-in alignment pins. See Figure 3.
Pour the recommended solder balls into the upper half of the fixture. Tilt the fixture slightly, or block the solder ball chute to prevent solder balls from escaping.
The solder ball stencil sits slightly above the surface of the component. This spacing gap reduces the possibility of flux contaminating the underside of the solder ball stencil.
Use a small brush or other approved tool to spread the solder balls filling all the aperture cavities.
Tilt the fixture slightly to pour the excess solder balls into a collection container.
Remove the upper half of the fixture relying on the flux to keep the solder balls in place.
Place the fixture and component into a convective reflow oven, batch oven, or IR system to reflow the solder balls following an approved reflow cycle.
Remove the fixture after reflow and allow to cool. Remove the reballed component and inspect it to ensure each pad has a properly reflowed solder ball.
Figure 1. The fixture uses two stacked stencils to create a shelf to precisely align the component in the fixture.
Do you prefer to send BGA components to a qualified contractor to add or replace the solder balls?
Consider using Circuit Technology Center.
Visit our BGA Reball Services page for details.
Scrap and obsolete printed circuit boards often contain valuable and difficult-to-source electronic components.
The experts at Circuit Technology Center have the experience, equipment, and process knowledge to safely and reliably remove and
salvage all types of components from fully assembled printed circuit boards, including fine-pitch QFPs, BGAs, LGAs, and multi-pin through-hole connectors.
Visit our Component Salvage Services page for details.
Custom Design - Questions
Do you need a reball fixture for a component that is not included in our list?
We're happy to build a web page with specifications for your review. There is no cost for this service.
Fill in the fields below and upload a data sheet for the BGA component. The data sheet must include the component part number, component body size, ball arrangement, pitch etc.
We'll create a web page with details and specifications. We'll send you an email once completed.
