CircuitMedic BGA Reball Fixtures are precision-engineered for specific BGA components. Each fixture consists of an upper and lower aluminum frame, with precision laser-cut stainless steel templates secured to both halves. The design features no moving parts, ensuring consistent precision and accuracy.

How it Works

1. Pad Preparation: Excess solder is removed from the BGA component pads using solder braid or another suitable method, creating a flat, even surface on each pad.
2. Flux Application: Solder flux is applied to the prepared pads of the BGA component.
3. Component Placement: The BGA component is positioned into the lower half of the fixture.
4. Solder Ball Loading: The upper half of the fixture is mated with the lower half. Solder balls are then dispensed to fill the stencil apertures.
5. Excess Solder Balls: Excess solder balls are poured out through a chute and can be reused.
6. Inspection: The upper half of the fixture is removed carefully. The component is visually inspected to confirm a solder ball is seated on each pad.
7. Reflow: The lower half of the fixture, along with the BGA component, is placed into a convective reflow oven, batch oven, or IR system to reflow the solder balls.
8. Completion: After the reflow cycle, the component is removed from the fixture and is ready for reuse.

All BGA Reball Fixtures cost $395.00.
Delivery is 10 days after order.

If we don't have a fixture matching the size you need, see the form at the bottom of this page.