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115-1322 Circuit Bond Kit

  • Kit contains 10 packages of clear, low viscosity, superior strength epoxy ideal for circuit board use.

  • The epoxy is precisely measured in two-compartment plastic packages, is easy to use, and requires no measuring.

The Circuit Bond Kit contains ten packages of clear, low viscosity, superior strength epoxy, precisely measured into two-compartment plastic packages. This adhesive is easy to use, and there's no measuring.

Once cured, this epoxy makes an effective electrical insulator with good high-temperature, mechanical, and impact resistance properties. Circuit Bond can be used to bond replacement conductors, repair burns and circuit board surface defects, and many other high-strength, high-temperature applications. You can also tint Circuit Bond using Color Agents for the perfect cosmetic match.
Circuit Bond Specifications
Packaging2 gram pre-measured packages
Mix ratio4 parts resin to 1 part hardener
ColorClear, transparent
Pot life30 minutes
Cure cycle24 hours at room temperature or 4 hours @ 149°F (65°C)
Viscosity (after mixing)2000 cps
Operating temperature range-67°F to 275°F (-55°C to 135°C)
Hardness88 Shore D
Dielectric strength400 volts/mil
Shelf Life6 months minimum.
ShippingShipping by FedEx and UPS only.
More InformationSee more information.
Features
Two-compartment packaging eliminates mixing errors.
High strength/high temperature epoxy withstands demanding physical environments.
Clear, can be tinted with coloring agents.
Includes Foam Swabs for preparation and cleaning.
Includes Micro Probes, ideal for dispensing a tiny volume of adhesive.
Ordering
Part No. Description Price Qty / Order
115-1322 Circuit Bond Kit $179.00 Each
Order direct or from a distributor. Freight, duties, and value added taxes may increase prices for products outside the USA.
Classifications
Harmonize Code 3506.91.0000
Export Administration Regulations (EAR) EAR99
Export Control Classification Number (ECCN) Not Applicable
Circuit Bond Kit Includes
Qty Part No. / Item Price Qty / Order
10
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115-3302 Circuit Bond Epoxy
Clear, superior strength epoxy in two-compartment plastic packages.
$16.95 Each
Pkg/5
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235-2102-5 Foam Swab, Small
Swabs for use with solvents and application of color agents and epoxies.
$9.50 Pkg/5
Pkg/5
image
235-2108-5 Foam Swab, Large
Swabs for use with solvents and application of color agents and epoxies.
$13.95 Pkg/5
Pkg/5
image
355-3102-5 Micro Probes
Sharp probes for dispensing adhesive and positioning small objects.
$4.95 Pkg/5
2 Pkg/5
image
115-3315-5 Mixing Picks
Disposable mixing sticks for mixing and applying adhesives.
$2.95 Pkg/5
2 Pkg/5
image
115-3312-5 Plastic Cup
Small disposable cup for mixing epoxies and holding small items.
$5.95 Pkg/5
Optional Color Agents
Part No. / Item Price Order
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115-9102 Color Agent, Yellow
Use to tint epoxy for solder mask and base board repair.
$21.95 Each
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115-9185 Color Agent, Red
Use to tint epoxy for solder mask and base board repair.
$21.95 Each
image
115-9293 Color Agent, Blue
Use to tint epoxy for solder mask and base board repair.
$21.95 Each
image
115-9348 Color Agent, Green
Use to tint epoxy for solder mask and base board repair.
$21.95 Each
image
115-9358 Color Agent, Light Green
Use to tint epoxy for solder mask and base board repair.
$21.95 Each
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115-9376 Color Agent, Medium Green
Use to tint epoxy for solder mask and base board repair.
$21.95 Each
image
115-9424 Color Agent, Dark Gray
Use to tint epoxy for solder mask and base board repair.
$21.95 Each
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115-9457 Color Agent, Light Brown
Use to tint epoxy for solder mask and base board repair.
$21.95 Each
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115-9560 Color Agent, Dark Green
Use to tint epoxy for solder mask and base board repair.
$21.95 Each
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115-9561 Color Agent, Green
Use to tint epoxy for solder mask and base board repair.
$21.95 Each
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115-9995 Color Agent, Black
Use to tint epoxy for solder mask and base board repair.
$21.95 Each
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115-9996 Color Agent - White
Use to tint epoxy for solder mask and base board repair.
$21.95 Each
Instructions and Safety Data Sheets
Instructions 115-1322 Circuit Bond Kit
Circuit Bond
Color Agent
Reference Guide Procedures
Number / Title
1.0 Foreword
2.0 Basic Procedures
2.2 Cleaning
2.4.1 Coating Replacement, Solder Mask
2.5 Baking and Preheating
2.7 Epoxy Mixing and Handling
3.0 Base Board Procedures
3.5.1 Base Material Repair, Epoxy Method
3.5.2 Base Material Repair, Area Transplant
3.5.3 Base Material Repair, Edge Transplant Method

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