This kit includes all the tools and materials you need to protect heat sensitive areas of an assembled circuit board from excessive heat exposure during rework operations. This kit is is ideal for the protection of adjacent components at risk of collateral heat damage during hot gas BGA rework.
During component rework, protection of nearby components is often mandatory to avoid collateral heat damage or inadvertent reflow.
Collateral heat damage or unintended reflow of adjacent component solder connections can result in component damage, oxidation, de-wetting, pad damage, wicking, starved joints and scorching. These issues can create new unintended rework problems. The rework technician must be constantly aware of the effect of heat on the target device or circuit, plus how it affects components near the target device on both sides of the assembly.
The kit includes sheets of aluminized heat shielding material, aluminum plates, high temperature liquid mask, high temperature tape, scissors and a variety of tools.