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115-2706 Bonding Film

115-2706 Bonding Film
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This sheet of Bonding Film is 1.50" x 2.25" (3.8 x 5.7 cm) in size. It is the same dry adhesive film we apply to circuit frames. Works great when you need to repair lifted pads and conductors without the need to use messy liquid adhesives.

Specifications
Overall Size 2.25" x 1.50" (57 x 38 mm)
Adhesive Phenolic film adhesive .002" (.051 mm) thick.
Bonding Temperature 475°F +/- 25°F (246°C +/- 14°C)
Bonding Time 30 seconds
Peel Strength Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life 1 year minimum.
REACH CircuitMedic Bonding Film contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH.
Outgassing CircuitMedic Bonding Film consistently meets the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06%


More Information
Ordering
Part No. Description Price Order
115-2706 115-2706 Bonding Film $16.50 Each
Order direct or from a distributor. Harmonize Code: 3909.40.0000
Freight, duties, and value added taxes may increase prices for products outside USA.
Related
115-3102
Bonding Iron, 120 VAC
Delivers the optimal heat for curing adhesive bonding film.
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