This kit includes the tools and materials needed to reliably replace damaged lands, surface mount and BGA pads. The Circuit Frames used to replace these conductor patterns do not have an adhesive backing and are bonded to the circuit board surface using epoxy supplied with the kit.
This kit that is specifically designed for Aerospace applications where out-gassing of epoxy may be an issue. All the tools and materials are packaged in a rugged ESD safe carrying case.
Kit includes everything you need for pad and land repair or replacement.
Materials conforms to IPC guidelines.
Replacement lands and pads are bonded with liquid epoxy include with the kit.