Wire Dots
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Clean up your act when bonding wires. Wire Dots make the job of bonding jumper wires neat and fast.
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Who wants to see a mess like this when bonding wires with messy glues and adhesives.
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Wire Dots are available in four sizes for bonding single wires or groups of wires.
Clean up your act when bonding wires. Wire Dots make the job of bonding jumper wires neat and fast.
Wire Dots are a wire tacking system consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high-performance, electronics grade permanent pressure-sensitive
adhesive. The result is a highly conformable, high-strength bond.
The adhesive on Wire Dots is commonly used for graphic attachment and membrane switch applications because it has excellent long-term quality, consistency, and durability.
Wire Dots perform well after exposure to high humidity, UV, immersion in water, and hot/cold cycles.
Wire Dots will hold secure after exposure to numerous chemicals including cleaning solutions/sprays, saponifiers, mild acids, and alkalies, and will hold secure through a typical circuit
board hot water wash.
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| Cover Film |
Clear Polyester Film 1.0 mil (.025 mm) Thick |
| Adhesive |
High performance Acrylic Adhesive 5.2 mils (0.13 mm) Thick (3M #3468MP) |
| Relative High Temperature Operating Ranges |
Short term (minutes/hours) 400°F (204°C)
Long term (days/weeks) 300°F (149°C) |
| Application |
Specifically designed for long term bonding to printed circuit boards and high surface energy plastics for the aerospace, medical and industrial equipment, automotive, appliance and electronic
markets.
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| Shelf Life |
Minimum 12
months.
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| Safety Data Sheet |
www.circuitmedic.com/msds/msds_wire_dots.html
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| Property |
Typical Value |
Unit |
Test Method |
| Peel Strength 72 hrs @ 22 C |
84 |
0z./in. |
ASTM D3330 Modified |
| Static Shear Strength 72 F (22 C) / 1000g |
>10,000 |
min |
ASTM D3654 |
| Tensile Strength (Yield) 72 F (22 C) |
>2600 |
psi |
ASTM D2370 |
| Elongation |
100 |
% |
ASTM D2370 |
| Thermal Conductivity |
0.17 |
w/m-k |
ASTM C518 |
| Coefficient of Thermal Expansion |
5.5 x 10 -4 |
m/m/C |
ASTM D696 25-175C |
| Property |
Typical Value |
Unit |
Test Method |
| Dielectric Strength |
1700 |
volts/mil |
ASTM D149 |
| Dielectric Constant 25 C, 1 kHz |
3.4 |
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ASTM D150 |
| Dissipation Factor 25 C, 1 kHz |
0.018 |
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ASTM D150 |
| Surface Resistivity - Adhesive Layer |
>1 x 10 14 |
ohm/square |
ASTM D257 |
| Surface Resistivity - Polymer Film Layer |
>1 x 10 16 |
ohm/square |
ASTM D257 |
| Volume Resistivity - Adhesive Layer |
>1 x 10 15 |
ohm/cm |
ASTM D257 |
| Volume Resistivity - Polymer Film Layer |
>1 x 10 18 |
ohm/cm |
ASTM D257 |
| Insulation/Moisture Resistance - Adhesive Layer |
>1 x 10 11 |
ohm |
MIL-I-46058C (100 VDC 60 sec) |
| Insulation/Moisture Resistance - Polymer Film Layer |
>1 x 10 12 |
ohm |
MIL-I-46058C (100 VDC 60 sec) |
| Voltage Breakdown |
3500 |
volts |
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