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Circuit Frames

Description
Operating Instructions
Applicable Safety Data Sheets
Alcohol Swab
Circuit Bond
Circuit Frame/Bonding Film
Coating Remover Pen
Color Agent
Conductive Pen
Electroclean Plating Solution
Gold Plating Solution
High Temperature Mask
Nickel Plating Solution
Solder Strip Solution
Reference Procedures
1.0 Foreword
2.0 Basic Procedures
2.1 Handling Electronic Assemblies
2.2 Cleaning
3.0 Base Board Procedures
4.1.1 Lifted Conductor Repair, Epoxy Seal Method
4.1.2 Lifted Conductor Repair, Film Adhesive
4.2.1 Conductor Repair, Foil Jumper, Epoxy Method
4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
4.4.1 Lifted Land Repair, Epoxy Seal
4.4.2 Lifted Land Repair, Film Adhesive
4.5.1 Land Repair, Epoxy Method
4.5.2 Land Repair, Film Adhesive
4.6.1 Edge Contact Repair, Adhesive Method
4.6.2 Edge Contact Repair, Film Adhesive
4.7.3 BGA Pad Repair, Film Adhesive
Questions?
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Robotic BGA Solder Ball Removal
Robotic BGA Solder Ball Removal
Watch a video that shows robotic BGA component deballing. This precision process is highly reliable when preparing BGA components for reballing.
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BGA Component Reball Video
BGA Component Reball Video
Video demonstrates robotic BGA component deballing. This precision process is highly reliable when preparing BGA components for reballing.
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A Simple Fix for Damaged Conductors
A Simple Fix for Damaged Conductors
There is a quick and reliable IPC recommended repair for damaged conductors. The replacement conductor matches the original. Discover the secret.
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Tough Engineering Changes?
Tough Engineering Changes?
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Surgeon grade rework and repair,
by the book and guaranteed. ®