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Circuit Frames

Description
Operating Instructions
Applicable Safety Data Sheets
Alcohol Swab
Circuit Bond
Circuit Frame/Bonding Film
Coating Remover Pen
Color Agent
Conductive Pen
Electroclean Plating Solution
Gold Plating Solution
High Temperature Mask
Nickel Plating Solution
Solder Strip Solution
Reference Procedures
1.0 Foreword
2.0 Basic Procedures
2.1 Handling Electronic Assemblies
2.2 Cleaning
3.0 Base Board Procedures
4.1.1 Lifted Conductor Repair, Epoxy Seal Method
4.1.2 Lifted Conductor Repair, Film Adhesive
4.2.1 Conductor Repair, Foil Jumper, Epoxy Method
4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
4.4.1 Lifted Land Repair, Epoxy Seal
4.4.2 Lifted Land Repair, Film Adhesive
4.5.1 Land Repair, Epoxy Method
4.5.2 Land Repair, Film Adhesive
4.6.1 Edge Contact Repair, Adhesive Method
4.6.2 Edge Contact Repair, Film Adhesive
4.7.3 BGA Pad Repair, Film Adhesive
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Surgeon grade rework and repair,
by the book and guaranteed. ®