525-2101-2 Circuit Frame, Assortment, Tin/Lead Plated

Circuit Frames are used to replace damaged surface mount pads, lands, and conductors. Circuit Frames have a dry-film adhesive backing that is cured in 30 seconds using heat from a bonding Iron. The replaced pad, land, or conductor has a bond strength equal to the original, and no messy liquid epoxies are used for bonding. This reliable IPC-recommended procedure meets the highest conformance level for this type of circuit board rework or repair. For over 40 years, Circuit Frames have been used by thousands of commercial, medical, and military manufacturers around the globe.

If you require a specific pattern not currently available, submit a request using the Contact Form lower on this page.

-	Qty	Shapes, Patterns Included
A	9	SMD Pads 0.012" x 0.080" (0.30 mm x 2.03 mm)
A	8	SMD Pads 0.018" x 0.080" (0.46 mm x 2.03 mm)
B	8	SMD Pads 0.025" x 0.080" (0.63 mm x 2.03 mm)
B	7	SMD Pads 0.030" x 0.055" (0.76 mm x 1.40 mm)
C	6	BGA Pads 0.015" (0.38 mm) Diameter
C	8	BGA Pads 0.020" (0.51 mm) Diameter
C	14	BGA Pads 0.025" (0.63 mm) Diameter
D	5	PTH Lands 0.050" OD x 0.030" ID (1.27 mm OD x 0.76 mm ID)
D	4	PTH Lands 0.060" OD x 0.040" ID (1.52 mm OD x 1.00 mm ID)
D	7	PTH Lands 0.070" OD x 0.040" ID (1.78 mm OD x 1.00 mm ID)
E	1	Conductors 0.006" (0.15 mm) wide
E	2	Conductors 0.009" (0.23 mm) wide
E	2	Conductors 0.012" (0.30 mm) wide
F	1	Edge Contacts .050" (1.27 mm) wide
F	1	Edge Contacts .060" (1.52 mm) wide