525-2402-1 Circuit Frame

$63.00 DATA SHEET
525-2402-1 Circuit Frame
Circuit Frames provide a reliable method for replacing damaged surface mount pads, lands, and conductors on circuit boards. Featuring a dry-film adhesive backing, they bond quickly using heat from a Bonding Iron or Bonding System, eliminating the need for liquid epoxies. The resulting bond strength matches the original conductor and follows IPC-recommended repair procedures.

Trusted for more than 40 years, Circuit Frames are widely used by commercial, medical, and military manufacturers for high-reliability circuit board rework and repair applications. If you require a custom shape, submit a request using our Contact Us form.
Ordering
Part No. Description Price Qty / Order
525-2402-1 Circuit Frame, SMD Pads, Bright Tin Plated $63.00
525-2402-1X Circuit Frame, SMD Pads, Bright Tin Plated, No Adhesive $63.00
Shapes and Pattens
  -   Qty Shapes, Patterns Included
A18SMD Pads 0.012" x 0.060" (0.46 mm x 1.52 mm)
B16SMD Pads 0.025" x 0.080" (0.63 mm x 2.03 mm)
C12SMD Pads 0.030" x 0.055" (0.76 mm x 1.40 mm)
D12SMD Pads 0.045" x 0.110" (1.14 mm x 2.80 mm)
E10SMD Pads 0.060" x 0.080" (1.52 mm x 2.03 mm)
F4SMD Pads 0.130" x 0.177" (3.30 mm x 4.50 mm)
Base Material Specifications
Overall Frame Size 2.25" x 1.50" (57 x 38 mm)
Base Material Rolled Annealed Copper Foil, UNS C11000 (Alloy C110), ASTM B152, IPC-4562A, 0.0014 in (0.036 mm) thick.
Plating .0001" (.0025 mm) Bright Tin (Lead Free), RoHS Compliant
Surface Treatments Top side plated. Bottom side treated to promote adhesion.
Shelf Life Shelf life of base material without adhesive application is unlimited.
RoHS and REACH CircuitMedic Circuit Frames contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH.

Adhesive Backing Specifications
Adhesive Backing Optional adhesive backing film is applied using a quick-bond process that retains B-staged adhesive properties.
Adhesive Material B-staged modified acrylic film adhesive .002" (.051 mm) thick.
Certification Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films.
Solder Resistance Passes IPC-TM-650, 2.4.13 Solder Float Resistance 10 seconds at 288°C (550°F).
Bonding Temperature 475°F ± 25°F (246°C ± 14°C)
Bonding Pressure 200 - 400 psi (14-28 kg/cm2)
Bonding Time 30 seconds
Peel Strength Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Outgassing The Bonding Film used on Circuit Frames consistently meet the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06%
Shelf Life One year minimum. Each Circuit Frame package is stamped with the expiration date. Adhesive material is sensitive to light and heat. Store in a dark or refrigerated environment to preserve the shelf life.
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Classifications
Harmonize Code 7410.21.6000
Export Administration Regulations (EAR) EAR99
Export Control Classification Number (ECCN) Not Applicable
525-2402-1 Circuit Frame
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