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CC076190AG Circuit Frame, Contacts .076" x .190" (1.93 mm x 4.83 mm), Nickel/Gold Plated

CC076190AG
Slightly Larger Than Actual Size.
Circuit Frames are used to replace damaged surface mount pads, lands, and conductors. Circuit Frames have a dry-film adhesive backing that is cured in 30 seconds using heat from a bonding Iron. The replaced pad, land, or conductor has a bond strength equal to the original, and no messy liquid epoxies are used for bonding.

This reliable IPC-recommended procedure meets the highest conformance level for this type of circuit board rework or repair. For over 40 years, Circuit Frames have been used by thousands of commercial, medical, and military manufacturers around the globe.

If you require a specific pattern not currently available, submit a request using the form lower on this page.
No longer available after stock is depleted.
See cross reference No. 525-2901-3.
The cross reference part may not contain the exact same patterns.
Base Material Specifications
Overall Frame Size 2.25" x 1.50" (57 x 38 mm)
Base Material Rolled annealed copper foil .0014" (.036 mm) thick.
Plating .000050" (.00127 mm) Gold over .000100" (.00254 mm) Nickel, RoHS Compliant
Surface Treatments Top side plated. Bottom side treated to promote adhesion.
Shelf Life Shelf life of base material without adhesive application is unlimited.
RoHS and REACH CircuitMedic Circuit Frames contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH.
Adhesive Backing Specifications
Adhesive Backing Optional adhesive backing film is applied using a quick-bond process that retains B-staged adhesive properties.
Adhesive Material B-staged modified acrylic film adhesive .002" (.051 mm) thick.
Certification Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films.
Solder Resistance Passes IPC-TM-650, 2.4.13 Solder Float Resistance 10 seconds at 288°C (550°F).
Bonding Temperature 475°F ± 25°F (246°C ± 14°C)
Bonding Pressure 200 - 400 psi (14-28 kg/cm2)
Bonding Time 30 seconds
Peel Strength Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Outgassing The Bonding Film used on Circuit Frames consistently meet the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06%
Shelf Life One year minimum. Each Circuit Frame package is stamped with the expiration date. Adhesive material is sensitive to light and heat. Store in a dark or refrigerated environment to preserve the shelf life.
Ordering
Part No. Description Price Qty / Order
CC076190AG Circuit Frame, Contacts .076" x .190" (1.93 mm x 4.83 mm), Nickel/Gold Plated $199.00 Each
Order direct or from a distributor. Freight, duties, and value added taxes may increase prices for products outside the USA.
Classifications
Harmonize Code 7410.21.6000
Export Administration Regulations (EAR) EAR99
Export Control Classification Number (ECCN) Not Applicable
Optional Items
Part No. Description Price Qty/Order
115-2706
115-2706 Bonding Film
Bonding Film
Dry film adhesive used to bond lifted lands, pads and conductors.
$16.50 Each
115-3210
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Bonding Iron, 120 VAC
Delivers the optimal heat for curing adhesive bonding film.
$69.00 Each
115-3220
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Bonding Iron, 220 VAC
Delivers the optimal heat for curing adhesive bonding film.
$74.00 Each
115-2801
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Bonding Tip, Tapered
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each
115-2802
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Bonding Tip, .080" (2.03 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each
115-2803
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Bonding Tip, .120" (3.05 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each
115-2804
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Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm)
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each
115-2805
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Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm)
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each

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