CS040110AT Circuit Frame Surface Mount Pads .040" x .110" (1.016 mm x 2.794 mm)
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Imagine replacing damaged surface mount pads, lands and conductors without the mess of liquid epoxy, with a bond strength equal to the original, in just a few minutes.
Circuit Frames with dry-film adhesive backing make this delicate repair procedure easy, fast and highly reliable.
This reliable IPC recommended procedure meets the highest conformance level for this type of repair.
For over 30 years Circuit Frames have been used by thousands of commercial, medical and military manufacturers around the globe.
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| Overall Frame Size |
2.25" x 1.50" (57 x 38 mm) |
| Description |
Surface Mount Pads .040" x .110" (1.016 mm x 2.794 mm) |
| Plating |
Tin/Lead |
| Base Material |
Rolled annealed copper foil .0014" (.036 mm) thick. |
| Adhesive Backing |
B-staged modified acrylic film adhesive .002" (.051 mm) thick. |
| Certification |
Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films. |
| Solder Resistance |
Passes IPC Spec 10 sec at 288°C (550°F). |
| Bonding Temperature |
475°F ± 25°F (246°C ± 14°C) |
| Bonding Pressure |
200 - 400 psi (14-28 kg/cm2) |
| Bonding Time |
30 seconds |
| Peel Strength |
Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material. |
| Shelf Life |
1 year minimum. Each Circuit Frame package is stamped with the expiration date. |
| Plating |
.0001" (.0025 mm) 63/37 Tin/Lead |
| RoHS and REACH |
CircuitMedic Circuit Frames contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH. |
| Outgassing |
The Bonding Film used on Circuit Frames consistently meet the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM.
Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06% |
| Compliance |
Non RoHS Compliant
IPC4562A and IPC4562/7
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| Part No. |
Description |
Price |
Qty / Order |
| CS040110AT |
Surface Mount Pads .040" x .110" (1.016 mm x 2.794 mm) |
$47.00 Each |
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No minimum order required.
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Order direct or from a distributor. Harmonize Code: 7410.21.6000
Freight, duties, and value added taxes may increase prices for products outside USA.
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| Part No. |
Description |
Price |
Order |
| 115-3104 |
Bonding Station, 120 VAC
Delivers the optimal heat for curing adhesive bonding film.
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$119.00 Each |
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| 115-3105 |
Bonding Station, 230 VAC
Delivers the optimal heat for curing adhesive bonding film.
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$119.00 Each |
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| 115-2104 |
Bonding Tip, Tapered
Tip used to bond replacement conductors to circuit boards for repair.
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$109.00 Each |
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| 115-2204 |
115-2204 Bonding Tip, .080" (2.03 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
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$45.00 Each |
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| 115-2206 |
115-2206 Bonding Tip, .120" (3.05 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
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$45.00 Each |
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| 115-2306 |
115-2306 Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm)
Tip used to bond replacement conductors to circuit boards for repair.
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$45.00 Each |
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| 115-2316 |
115-2316 Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm)
Tip used to bond replacement conductors to circuit boards for repair.
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$45.00 Each |
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